Bangladesh Semiconductor Industry Association has concluded a major engagement programme in South Korea, strengthening Bangladesh’s ambition to establish itself as a future semiconductor hub through international partnerships, advanced packaging initiatives and workforce development.
The visit formed part of the association’s wider global semiconductor roadshow aimed at attracting strategic collaboration with leading industry players and positioning Bangladesh within the rapidly evolving global chip supply chain.
The day opened with a high-level coordination meeting between BSIA representatives and the advanced team of SK hynix. Discussions focused on future cooperation in semiconductor packaging, engineering talent development and broader ecosystem collaboration as Bangladesh seeks to expand its footprint in the deep-tech sector.
Delegates from several Bangladeshi technology firms, including Dynamic Solution Innovators, Prime Silicon Technology Limited, Siliconova Limited, Ulkasemi Private Limited and Neural Semiconductor Ltd., also held talks with Korean design house SuperGate to explore partnerships in semiconductor design, verification services, embedded systems and AI-focused chip engineering.
A central feature of the programme was a bilateral meeting between BSIA and the Korea Semiconductor Industry Association. The talks examined proposals for a collaborative “15-nation semiconductor alliance” intended to improve global supply-chain resilience, talent mobility and long-term cooperation across emerging semiconductor economies.
The two sides also discussed joint training programmes, academic exchanges and research partnerships designed to strengthen engineering capabilities and develop a skilled semiconductor workforce in Bangladesh.
KSIA officials welcomed Bangladesh’s long-term semiconductor ambitions, highlighting the country’s growing engineering talent pool and strategic demographic advantages. Discussions explored the possibility of Bangladesh emerging as what participants described as the world’s “12th semiconductor hub” through sustained policy support and international collaboration.
The visit concluded with a reception jointly hosted by BSIA and the Embassy of Bangladesh in Seoul, attended by industry leaders, academics and policymakers from both countries.
During the event, Muhammad Mustafa Hussain of Purdue University presented Bangladesh’s vision for advanced semiconductor packaging, while representatives from McKinsey & Company outlined the growing importance of AI-driven packaging technologies and next-generation semiconductor infrastructure.